features UPB1513TU nec's 13 ghz input divide by 4 prescaler ic for satellite communications ? operati ng frequency : f in = 5 to 13 ghz ? low current consumption : i cc = 48 ma @ v cc = 5.0 v ? high-density surface mounting : 8-pin lead-less minimold ? supply voltage : v cc = 4.5 to 5.5 v ? division ratio : 4 applications ? point-to-point/ multi-point radios ? vsat radios description preliminary data sheet california eastern laboratories nec's UPB1513TU is a silicon germanium (sige) monolithic integrated circuit designed as a divide by 4 prescaler ic for satellite communications and point-to-point/multi-point radios. the package is 8-pin lead-less minimold suitable for surface mount. this ic is manufactured using our 50 ghz f max uhs2 ( u ltra h igh s peed process) silicon bipolar process. ordering information note with regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales of?ce. remark to order evaluation samples, contact your nearby sales of?ce. part number for sample order: UPB1513TU part number order number package marking supplying form UPB1513TU-e2 UPB1513TU-e2-a 8-pin lead-less minimold (pb-free) note 1513 ? 8 mm wide embossed taping ? pin 5, 6, 7, 8 indicates pull-out direction of tape ? qty 5 kpcs/reel
UPB1513TU internal block diagram and pin co nnections system application example pin no. pin name 1 v cc 1 2 in 3 gnd 4 in 5 out 6 gnd 7 out 8 v cc 2 (t op v iew) 2 3 4 1 7 6 5 8 regulator 1/2 1/2 pll 13 ghz prescaler 1/4 pb1513tu lna down-converter up-converter pa diplexer
UPB1513TU pin e xplanation pin no. pin name applied voltage (v) function and applications 1 v cc 1 5 power supply pin. this pin must be equipped with bypass capacitor (example : 100 pf and 10 nf) to minimize ground impedance. 2 in ? signal input pin. this pin should be coupled to signal source with capasitor (example : 100 pf) for dc cut. 3 gnd 0 ground pin. ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 in ? signal input bypass pin. this pin must be equipped with bypass capacitor (example : 100 pf) to minimize ground impedance. 5 out ? divided frequency output pin. this pin shoud be coupled to load device with capasitor (example : 100 pf) for dc cut. 6 gnd 0 ground pin. ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 out ? divided frequency output pin. this pin should be coupled to load device with capasitor (example : 100 pf) for dc cut. 8 v cc 2 5 power supply pin. this pin must be equipped with bypass capacitor (example : 100 pf and 10 nf) to minimize ground impedance.
UPB1513TU parameter symbol test conditions ratings unit supply voltage v cc t a = +25 c 6 v total power dissipation p d t a = +85 c note 867 mw thermal resistance (junction to ground paddle) r th(j-c) t a = +85 c note 75 c/w operating ambient temperature t a ? 40 to +85 c storage temperature t stg ? 55 to +150 c absolute maximum ratings note mounted on 33 21 0.4 mm polyimide pcb, with copper patterning on both sides. recommended operating range parameter symbol min. typ. max. unit supply voltage v cc 4.5 5.0 5.5 v operating ambient temperature t a ? 40 +25 +85 c electrical characteristics (v cc = 4.5 to 5.5 v, t a = ? 40 to +85 c, z s = z l = 50 ) parameter symbol test conditions min. typ. max. unit circuit current i cc no signals ? 48 75 ma input sensitibity p in1 f in = 5 to 6 ghz ? 8 ? ? 5 dbm p in2 f in = 6 to 12 ghz ? 8 ? 0 dbm p in3 f in = 12 to 13 ghz ? 5 ? 0 dbm output power p out f in = 5 to 13 ghz, single ended, p in = ? 5 dbm ? 11 ? 4 2 dbm
UPB1513TU typical characteristics (t a = +25oc, unless otherwise speci?ed) output power p out (dbm) frequency f (ghz) input sensitivity p in (dbm) frequency f (ghz) input sensitivity vs. frequency output power vs. frequency 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 0 5 10 15 20 guaranteed operating range v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v 3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -1 1 -12 0 5 10 15 20 p in = - 5 dbm v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v guaranteed operating range input sensitivity p in (dbm) frequency f (ghz) input sensitivity vs. frequency 15 10 5 0 -5 -10 -15 -20 -25 -30 -35 0 5 10 15 20 guaranteed operating range v cc = 3.0 v t a = - 40oc t a = + 25oc t a = + 85oc output power p out (dbm) frequency f (ghz) output power vs. frequency 3 2 1 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 -1 1 -12 0 5 10 15 20 guaranteed operating range t a = - 40oc t a = + 25oc t a = + 85oc v cc = 3.0 v p in = - 5 dbm remark the graphs indicate nominal characteristics.
UPB1513TU measurement circuits the application circuits and their parameters are for reference only and are not intended for actual design-ins. in gnd in v cc 1 2 3 4 1 7 6 5 8 100 pf 50 ? spectrum analyzer 100 pf 51 ? 100 pf 51 ? 100 pf signal generator 50 ? out gnd out v cc 2 5 v power supply 100 pf 10 nf
UPB1513TU illustration of the measurement circuit assembled on evaluation board remarks 1. 33 21 0.4 mm double-sided copper-clad polyimide pcb 2. back side: gnd pattern 3. solder plated on pattern 4. represents cutout 5. : through holes 51 ? 51 ? 100 pf 10 nf 100 pf 100 pf 100 pf 100 pf 1 2 3 4 8 7 6 5
UPB1513TU package dimensions 8-pin lead-less minimold (unit:mm) 1 2 3 4 8 7 6 5 2.20.05 2.00.1 (t op v iew) 0.50.03 4 3 2 1 5 6 7 8 0.40.1 0.40.1 (1.4) (0.75) (0.75) (0.25) (0.25) 0.160.05 (bottom v iew) 2.00.1 (0.35) (0.35) (0.35) (0.35) (0.5) (0.5) (0.6) (0.6) (0.65) (0.65) (0.6) (0.3) 0.125 +0.1 -0.0 5
a business partner of nec compound semiconductor devices, ltd. 01/04/05 life support applications these nec products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod ucts can reasonably be expected to result in personal injury . the customers of cel using or selling these products for use in such applications do so at their own risk and agree to fully indemnify cel for all damages resulting from such improper use or sale. UPB1513TU recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales of?ce. soldering method soldering conditions condition symbol infrared re?ow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of re?ow processes : 3 times maximum chlorine content of rosin ?ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of ?ow processes : 1 time maximum chlorine content of rosin ?ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin ?ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating). notes on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) keep the track length of the ground terminals as short as possible. (4) bypass capacitance must be attached to v cc line. (5) exposed heat sink at bottom on package must be soldered to pcb rf/dc ground.
4590 patrick henry drive santa clara, ca 95054-1817 telephone: (408 ) 9 19-250 0 facsimile : ( 40 8 ) 988-0279 subject: compliance with eu directives cel certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of european union (eu) directive 2002/95/ec restriction on use of hazardous substance s i n electrical and electronic equipment (rohs) and the requirements of eu directive 2003/11/ec restriction on penta and octa bde. cel pb-free products have the same base part number with a suffix added. the suffix Ca indicates that the device is pb-free. the Caz suffix is used to designate devices containing pb which are exempted from the requirement of rohs directive (*). in all cases the devices have pb-free terminals. all devices with these suffixes meet the requirements of the rohs directive. this status is based on cels understanding of the eu directives and knowledge of the materials that go into its products as of the date of disclosure of this information . restricted substanc e per rohs concentration limit per rohs (values are not yet fixed) concentration contained in cel devices -a -a z lead (p b) < 1000 ppm not detected (*) mercury < 1000 ppm not detected cadmiu m < 100 ppm not detected hexavalent chromiu m < 1000 ppm not detected pbb < 1000 ppm not detected pbde < 1000 ppm not detected if you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. important information and disclaimer: informatio n p rovided by ce l o n its website or in other communications concertin g the substan ce content of its products represents knowledge and belief as of the date that it is provided. cel bases its know ledge and belief on informatio n provided by thir d p arties and makes no representation or warrant y as to the accura cy of such information. efforts are underw ay to better integrate information from third parties. cel has taken and continues to take reasonable steps to provide representative and ac curate information but ma y not have conducted destructive testing or chemical analysis on incoming ma terials and chemicals. cel and ce l suppliers consider certain information to be propri etar y, and thus cas numbers and other limited information may not be availabl e for release . in no event shall cels liability arising out of such information exceed the total purchase price of the cel part(s) at issue s old by cel to customer on an annual basis. see cel terms and conditions for additional clarification of wa rranties and liabilit y.
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